陈卉灿, 刘昊宇, 包博, 喻建瑜, 徐春华, 刘崇茹. 基于载波相移的MMC电磁暂态仿真模型封装控制器设计[J]. 现代电力, 2020, 37(1): 104-110. DOI: 10.19725/j.cnki.1007-2322.2019.0135
引用本文: 陈卉灿, 刘昊宇, 包博, 喻建瑜, 徐春华, 刘崇茹. 基于载波相移的MMC电磁暂态仿真模型封装控制器设计[J]. 现代电力, 2020, 37(1): 104-110. DOI: 10.19725/j.cnki.1007-2322.2019.0135
CHEN Huican, LIU Haoyu, BAO Bo, YU Jianyu, XU Chunhua, LIU Chongru. Design of Packaged Controllers for Modular Multilevel Converter Electromagnetic Transient Simulation Model Based on CPS-SPWM[J]. Modern Electric Power, 2020, 37(1): 104-110. DOI: 10.19725/j.cnki.1007-2322.2019.0135
Citation: CHEN Huican, LIU Haoyu, BAO Bo, YU Jianyu, XU Chunhua, LIU Chongru. Design of Packaged Controllers for Modular Multilevel Converter Electromagnetic Transient Simulation Model Based on CPS-SPWM[J]. Modern Electric Power, 2020, 37(1): 104-110. DOI: 10.19725/j.cnki.1007-2322.2019.0135

基于载波相移的MMC电磁暂态仿真模型封装控制器设计

Design of Packaged Controllers for Modular Multilevel Converter Electromagnetic Transient Simulation Model Based on CPS-SPWM

  • 摘要: 模块化多电平换流器(modular multilevel converter,MMC)进行电磁暂态仿真时,面临着控制元件数量庞大、数据信号维数转换复杂等建模方面的问题。针对上述问题,提出了采用载波相移脉宽调制的MMC控制系统的高效建模方法。通过调用子程序实现经典控制器封装,解决了高维信号交互以及控制元件数量庞大的问题。通过控制模块自身重复调用等效子程序代替了建模过程中需要不断复制控制元件的过程,大大减少了仿真占用的计算资源。通过数组的形式进行多维数据交互,进一步简化了MMC建模过程。经PSCAD/EMTDC的仿真测试,提出的封装控制模型在降低建模规模的同时,具备与控制元件搭成的控制模型相同的精度。

     

    Abstract: As is known that large number of control components and complicated data dimension transformation seriously reduce efficiency for building modular multilevel converter (MMC) model. Targeting at the above problems, a convenient and efficient modelling method for MMC control system based on CPS-SPWM is proposed in this paper. The scheme calls subroutines to package classic controller to deal with large amount of control components and transformation between data with different dimension. Equivalent control subroutines are designed in the packaged controller, which significantly reduces the labor of duplication of large amount of control components and saves computational resources. The control signals are designed and processed in array form, which significantly simplifies the complextiy of the large amount of signal exchange. Simulations results in PSCAD/EMTDC show that the packaged controllers share same accuracy with model using control components.

     

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